Pain Relief Spray​​

ANKLE PAIN

Best Knee Pain Gel

 

What Causes Ankle Pain?

 

Ankle pain is generally caused due to sprain in the ankle. Ankle pain refers to any kind of pain or discomfort affecting any part of the ankle. Ankle pain can happen for many reasons. The most common causes include injury, arthritis and normal wear and tear.

Depending on the cause, you may feel pain or stiffness anywhere around the ankle. Your ankle may also swell, and you may not be able to put any weight on it. Usually, ankle pain gets better with rest, ice and over-the-counter pain medications.

Healthcare providers can treat injuries and arthritis. Oftentimes, conditions can be treated without surgery. However, if the injury is severe, such as a broken ankle bone, or when your ankle pain fails to improve with nonsurgical treatment, surgery is needed. If you’ve had an ankle injury or surgery, a physical therapy (PT) plan can also help you heal. PT strengthens the muscles that support your feet and ankles.

The therapy can relieve pain and prevent future injuries. Pain relief sprays are commonly used to relieve ankle pain. However, conventional pain relief spray does not provide desired pain relief, because of incomplete penetration through the skin layers

 

Why is Dynapar QPS a leading Ankle Pain Relief Spray?


Dynapar QPS is the world’s first topical Diclofenac solution, providing rapid, powerful, and long-lasting pain relief by allowing Diclofenac to penetrate the skin barrier (Stratum corneum) more quickly after topical application. Diclofenac has a five times greater (5X) penetration than Diclofenac gel.

 

Advantages Of Using Dynapar QPS


The advantages of Dynapar QPS over Diclofenac gel have been established in multiple clinical trials published in reputable journals. Dynapar QPS’s potent action allows users to reduce or eliminate the use of commonly used oral pain relievers.

The advantages of using Dynapar QPS over Diclofenac gel include precise dosing, sophisticated application techniques, and total absorption, leaving no residue at the site of application